With years of experience in many industries, including the semiconductor industry, we learned how to meet a wide variety of material compatibility needs. This table is intended to help engineers specify which wet process tank and cleaning systems best fit their processes, chemistries, and applications. Please contact us for more information regarding material compatibility. Download PDF
| Process Name | Chemistry | Application | Process Tank |
|---|---|---|---|
| Si Iso Etch | HNO3+H2O+NH4F | Etch Silicon | PFA Tank (near ambient) |
| Oxide Etch | 10:1 HF (H2O+49% HF) | Etch Silicon Dioxide | PFA Tank with heat exchange coils |
| Buffered Oxide Etch | 5:1 (40% NH4F+49% HF) | Silicon Dioxide | PFA Tank with heat exchange coils |
| Quickdump Rinse | H2O | chemical removal | PVDF Quickdump |
| Post Hot Phos Rinse | H2O | Acid Rinse | PVDF Quickdump Megasonic |
| Post Piranha Rinse | H2O | Acid rinse, Sulfate removal | PVDF Quickdump Megasonic |
| SC-2, HPM, RCA2, Huang B | HCL+H2O2+H2O | Metals removal, alkalis and metal hydroxide removal | Quartz recirculated Megasonic |
| SC-1, APM,RCA1, Huang A | NH4OH+H202+H2O | Particle removal, light organics removal, protective oxide regrowth | Quartz recirculated Megasonic |
| EDP | NH2(CH2)2NH2+C6H4(OH)+H20 | Anisotropic Silicon Etch | Quartz static or recirculated |
| TMAH | TMAH | Anisotropic Silicon Etch | Quartz static or recirculated |
| Cu FeCl3 200 | Copper etchant type CE-200 from Transene (30% FeCl3 + 3-4% HCl + H2O) | Etch Copper | Quartz static or recirculated |
| Cu APS 100 | Copper etchant APS 100 from Transene (15-20% (NH4)2S2O8 + H2O) | Etch Copper | Quartz static or recirculated |
| NiCr TFN | Nichrome etchant TFN from Transene (10-20% (NH4)2Ce(NO3)6) + 5-6% HNO3 + H2O) | Etch NiCr | Quartz static or recirculated |
| Al Etch A | Al Etchant Type A from Transene (80% H3PO4 + 5% HNO3 + 5% HAc +10% H2O) | Etch Aluminum | Quartz static or recirculated |
| CR-14 | Chromium etchant CR-14 from Cyantek (22% (NH4) 2Ce(NO3)6) + 8% HAc+ H2O) | Etch Chromium | Quartz static or recirculated |
| CR-7 | Chromium etchant CR-7 from Cyantek (9% (NH 4)2Ce(NO3)6) + 6% HClO4 + H2O) | Etch Chromium | Quartz static or recirculated |
| Aqua regia | HCl+HNO3 | Etch Gold | Quartz static or recirculated |
| AU-5 | Gold etchant AU-5 from Cyantek (5% I2 +10% KI + 85% H2O) | Etch Gold | Quartz static or recirculated |
| Moly Etch | Molybdenum etchant (180 H3PO4 : 11 HAc : 11 HNO3 : 150 H2O) | Etch Molybdenum | Quartz static or recirculated |
| Aqua regia, Dilute | Dilute aqua regia (3 HCl : 1 HNO3 : 2 H2O), ~30ºC | Etch Noble metals | Quartz static or recirculated |
| Phos+Sulf | 1 H2SO4 : 1 H3PO4 | Etch Sapphire | Quartz static or recirculated |
| Pad Etch 4 | Pad Etch 4 from Ashland (13% NH 4F + 32% HAc + 49% H2O + 6% propyleneglycol + surfactant) | Etch SiO2, not Al | Quartz static or recirculated |
| Ti Etch | Titanium wet etchant (20 H2O : 1 H2O2 : 1 HF) | Etch Titanium | Quartz static or recirculated |
| H2O2 50ºC | Hydrogen peroxide (30wt% H2O2, 70wt% H2O) | Etch Tungsten | Quartz static or recirculated |
| SA-80 | (NH4)SO4+H2SO4 | Organics removal | Quartz static or recirculated |
| SOM, Sulfuric/Ozone mix | H2SO4+O3 | Organics removal | Quartz static or recirculated |
| DIO3, Ozinated water | DIH2O+O3 | Organics removal, protective SiO2 regrowth | Quartz static or recirculated |
| Microstrip | Microstrip 2001 photoresist stripper, 85ºC | Photoresist Strip | Quartz static or recirculated |
| Piranha, SPM | Piranha (~50 H2SO4 : 1 H2O2) | Resist strip, Post-ash residue removal, organic removal | Quartz static or recirculated |
| Phosphoric | Phosphoric Acid (85% by weight) | Etch Silicon nitride | Quartz static or recirculated; Dedicated Nitride Etch System |
| Proprietary Solvent Resist Strippers | Various Solvents | Remove Photoresist | Quartz Static or recirculated; Stainless Steel (static or recirculated) |
| IPA | Isopropanol | Cleaning | Stainless Steel static or recirculated |
| Methanol | Methanol | Cleaning | Stainless Steel static or recirculated |
| Acetone | Acetone | Photoresist Strip | Stainless Steel static or recirculated |
| Anisotropic Etch | KOH (30% by weight) | Anisotropic SiliconEtch | PFA Tank with In-Line Heater |