クイックドレンバルブ

You are here:

Home
クイック …

iPolymer Quick Dump (“QD”) Valves are designed to rapidly drain process tanks. Constructed from high-purity polymers, which are selected to meet your applications needs, our Quick Dump Valves are available in Polypropylene (POL), Polyvinylidene Fluoride (PVDF), Perfluoroalkoxy (PFA) or Polyvinyl Chloride (PVC). These valves are designed to be welded directly to the underside (bottom) of tanks. Our Quick Dump Valves are available configured with either O-Ring Seats or Domed Hard Seats. The Domed Hard Seat design prevents ponding/puddling of media on the valve piston and allows for a slight trickle of fluid. This plunger-style valve is very compact, while still configured with optional Air-to-Open/Spring-to-Close or Air-to-Open/Air-to-Close actuation.

クイックドレンバルブ仕様書 (PDF)

QDRV parts and spares for Imtec Accubath™ Tanks

仕様

Size	2”	4”
Actuation Pressure Range (psi)	60 / 70	45 / 55
Media Temperature Range – Polypropylene	30 – 140°F	30 – 140°F
Media Temperature Range – PVDF	20 – 212°F	20 – 212°F
Approximate Dump Rate (GPM @ 1ft Head)	30	60

Installation Instructions: At time of installation actuate valve at full actuation pressure and hold pressure while welding body in place.

Dimensions

Size	Seat	Base	A	B	C	D
2″	O-Ring	104520	2″	3″	3.0″	.78″
2″	Hard	104521	2″	3″	3.0″	.78″
4″	O-Ring	103809	4″	5″	3.0″	.78″
4″	Hard	103952	4″	5″	3.0″	.78″
4″ (high flow)	O-Ring	104602	4″	5″	4.0″	1.43″
4″ (high flow)	Hard	104683	4″	5″	4.0″	1.43″

Filter by:

Item #	Diameter	Seat Type	Open Method	Close Method	Material	O-Ring
QD-104520-POL-E-1	2-in	O-Ring Seat	Air Open	Spring Close	Polypro	EPDM
QD-104520-POL-E-2	2-in	O-Ring Seat	Air Open	Air Close	Polypro	EPDM
QD-104520-POL-V-1	2-in	O-Ring Seat	Air Open	Spring Close	Polypro	Viton
QD-104520-POL-V-2	2-in	O-Ring Seat	Air Open	Air Close	Polypro	Viton
QD-104520-PVDF-E-1	2-in	O-Ring Seat	Air Open	Spring Close	PVDF	EPDM
QD-104520-PVDF-E-2	2-in	O-Ring Seat	Air Open	Air Close	PVDF	EPDM
QD-104520-PVDF-V-1	2-in	O-Ring Seat	Air Open	Spring Close	PVDF	Viton
QD-104520-PVDF-V-2	2-in	O-Ring Seat	Air Open	Air Close	PVDF	Viton
QD-103809-POL-E-1	4-in	O-Ring Seat	Air Open	Spring Close	Polypro	EPDM
QD-103809-POL-E-2	4-in	O-Ring Seat	Air Open	Air Close	Polypro	EPDM
QD-103809-POL-V-1	4-in	O-Ring Seat	Air Open	Spring Close	Polypro	Viton
QD-103809-POL-V-2	4-in	O-Ring Seat	Air Open	Air Close	Polypro	Viton
QD-103809-PVDF-E-1	4-in	O-Ring Seat	Air Open	Spring Close	PVDF	EPDM
QD-103809-PVDF-E-2	4-in	O-Ring Seat	Air Open	Air Close	PVDF	EPDM
QD-103809-PVDF-V-1	4-in	O-Ring Seat	Air Open	Spring Close	PVDF	Viton
QD-103809-PVDF-V-2	4-in	O-Ring Seat	Air Open	Air Close	PVDF	Viton
QD-104602-POL-E-1	4-in	O-Ring High-Flow Seat	Air Open	Spring Close	Polypro	EPDM
QD-104602-POL-E-2	4-in	O-Ring High-Flow Seat	Air Open	Air Close	Polypro	EPDM
QD-104602-POL-V-1	4-in	O-Ring High-Flow Seat	Air Open	Spring Close	Polypro	Viton
QD-104602-POL-V-2	4-in	O-Ring High-Flow Seat	Air Open	Air Close	Polypro	Viton
QD-104602-PVDF-E-1	4-in	O-Ring High-Flow Seat	Air Open	Spring Close	PVDF	EPDM
QD-104602-PVDF-E-2	4-in	O-Ring High-Flow Seat	Air Open	Air Close	PVDF	EPDM
QD-104602-PVDF-V-1	4-in	O-Ring High-Flow Seat	Air Open	Spring Close	PVDF	Viton
QD-104602-PVDF-V-2	4-in	O-Ring High-Flow Seat	Air Open	Air Close	PVDF	Viton
QD-104521-POL-E-1	2-in	Hard Seat	Air Open	Spring Close	Polypro	EPDM
QD-104521-POL-E-2	2-in	Hard Seat	Air Open	Air Close	Polypro	EPDM
QD-104521-POL-V-1	2-in	Hard Seat	Air Open	Spring Close	Polypro	Viton
QD-104521-POL-V-2	2-in	Hard Seat	Air Open	Air Close	Polypro	Viton
QD-104521-PVDF-E-1	2-in	Hard Seat	Air Open	Spring Close	PVDF	EPDM
QD-104521-PVDF-E-2	2-in	Hard Seat	Air Open	Air Close	PVDF	EPDM
QD-104521-PVDF-V-1	2-in	Hard Seat	Air Open	Spring Close	PVDF	Viton
QD-104521-PVDF-V-2	2-in	Hard Seat	Air Open	Air Close	PVDF	Viton
QD-103952-POL-E-1	4-in	Hard Seat	Air Open	Spring Close	Polypro	EPDM
QD-103952-POL-E-2	4-in	Hard Seat	Air Open	Air Close	Polypro	EPDM
QD-103952-POL-V-1	4-in	Hard Seat	Air Open	Spring Close	Polypro	Viton
QD-103952-POL-V-2	4-in	Hard Seat	Air Open	Air Close	Polypro	Viton
QD-103952-PVDF-E-1	4-in	Hard Seat	Air Open	Spring Close	PVDF	EPDM
QD-103952-PVDF-E-2	4-in	Hard Seat	Air Open	Air Close	PVDF	EPDM
QD-103952-PVDF-V-1	4-in	Hard Seat	Air Open	Spring Close	PVDF	Viton
QD-103952-PVDF-V-2	4-in	Hard Seat	Air Open	Air Close	PVDF	Viton
QD-104683-POL-E-1	4-in	Hard High-Flow Seat	Air Open	Spring Close	Polypro	EPDM
QD-104683-POL-E-2	4-in	Hard High-Flow Seat	Air Open	Air Close	Polypro	EPDM
QD-104683-POL-V-1	4-in	Hard High-Flow Seat	Air Open	Spring Close	Polypro	Viton
QD-104683-POL-V-2	4-in	Hard High-Flow Seat	Air Open	Air Close	Polypro	Viton
QD-104683-PVDF-E-1	4-in	Hard High-Flow Seat	Air Open	Spring Close	PVDF	EPDM
QD-104683-PVDF-E-2	4-in	Hard High-Flow Seat	Air Open	Air Close	PVDF	EPDM
QD-104683-PVDF-V-1	4-in	Hard High-Flow Seat	Air Open	Spring Close	PVDF	Viton
QD-104683-PVDF-V-2	4-in	Hard High-Flow Seat	Air Open	Air Close	PVDF	Viton

*O-ring Seat Material is same as Body O-Ring Type. Hard Seat Material is same as Material of Construction.

Importance of Quick Dump Rinsing in Semiconductor Manufacturing

After chemical treatment of semiconductor wafers for cleaning, etching or stripping applications, or MEMS device KOH/HF etching applications, the process chemicals should be completely removed from the surface in order to stop the chemical reaction and take away chemical residues. Chemistry is still covering the wafer surface, in particular within recess structures of the topology (moats, trenches) resulting in continuation of the chemical process outside the bath. This is critical for etch applications, since over-etching might occur destroying the pattern and causing significant yield loss. Custom plastic tanks, PFA tanks are the common choices for quick dump rinsing steps.

Objectives of effective rinsing processes:

To quickly and effectively stop the chemical reaction on the surface after the wafers have been removed from the bath.
To fully remove chemical and contaminant residues from the wafer, which are carried over from the chemical bath without ANY impact on the wafer surface.
To take off particulates from the wafer before the next chemical step or drying.

Semiconductor rinse processes:

Three basic types of rinsing are used in semiconductor manufacturing, depending on the tool type and application.

Overflow rinsing: immersion of wafers into a rinse bath with continuous introduction of water from the bottom of the tank and overflowing at the top rim.
Spray rinsing: Dispense of ultra pure water through spray nozzles directly onto the wafer at variable flow, pressure or temperature in a single pass mode (standard process of single wafer equipment)
Quick dump rinsing: a combination of the above for wet benches consisting of placing the wafer into an overflowing rinse tank, dump the ultra pure water in a very fast manner and refill the tank by spray and /or fill from the bottom.

クイック ドレン バルブ