PTFE and PFA Fluoropolymers: a Comparison of Particulate Contamination and Process Purity
A Comparison of Particulate Contamination and Process Purity Advanced semiconductors are now being manufactured at device geometries of 10 nm and below. At these dimensions, the chip’s circuitry is incredibly dense, and particulate contamination, which can lead to chip failure, is a major concern. With particle contamination in mind, Heateflex Corporation and Saint-Gobain High Purity…