A Comparison of Particulate Contamination and Process Purity
Advanced semiconductors are now being manufactured at device geometries of 10 nm and below. At these dimensions, the chip’s circuitry is incredibly dense, and particulate contamination, which can lead to chip failure, is a major concern.
With particle contamination in mind, Heateflex Corporation and Saint-Gobain High Purity Systems partnered to conduct some experiments on two fluoropolymers, PTFE and PFA, commonly used for wetted parts in semiconductor manufacturing. These experiments clearly showed that PFA was a superior material for maintaining process purity in advanced semiconductor manufacturing applications.
Full article with published results of the experiments in Silicon Semiconductor Issue 1, 2019: https://siliconsemiconductor.net/article/106829/Comparing_PTFE_And_PFA_Fluoropolymers_As_Wetted_Parts_In_Advanced_Semiconductor_Manufacturing/feature
PDF: Comparing PTFE and PFA fluoropolymers as wetted parts in advanced semiconductor manufacturing